SMT行业常用名词缩写中英文对照.doc

SMT行业常用名词缩写中英文对照27————————————————————————————————作者：————————————————————————————————日期：个人收集整理勿做商业用途个人收集整理勿做商业用途个人收集整理勿做商业用途SMT行业常用名词缩写中英文对照AI：Auto—Insertion自動插件AQL:acceptablequalitylevel允收水準ATE：automatictestequipment自動測試ATM：atmosphere氣壓BGA:ballgridarray球形矩陣CCD：chargecoupleddevice監視連接元件(攝影機)CLCC：Ceramicleadlesschipcarrier陶瓷引腳載具COB：chip-on-board晶片直接貼附在電路板上cps:centipoises（黏度單位)百分之一CSB：chipscaleballgridarray晶片尺寸BGACSP：chipscalepackage晶片尺寸構裝CTE：coefficientofthermalexpansion熱膨脹系數DIP:dualin-linepackage雙內線包裝(泛指手插元件）FPT：finepitchtechnology微間距技術FR—4：flame—retardantsubstrate玻璃纖維膠片(用來製作PCB材質）IC:integratecircuit積體電路IR:infra—red紅外線Kpa：kilopascals（壓力單位)LCC：leadlesschipcarrier引腳式晶片承載器MCM：multi—chipmodule多層晶片模組MELF:metalelectrodeface二極體MQFP：metalizedQFP金屬四方扁平封裝NEPCON：NationalElectronicPackageandProductionConference國際電子包裝及生產會議PBGA：plasticballgridarray塑膠球形矩陣PCB:printedcircuitboard印刷電路板PFC:polymerflipchipPLCC:plasticleadlesschipcarrier塑膠式有引腳晶片承載器Polyurethane聚亞胺酯(刮刀材質）ppm:partspermillion指每百萬PAD(點)有多少個不良PAD(點）psi:pounds/inch2磅/英吋2PWB：printedwiringboard電路板QFP:quadflatpackage四邊平坦封裝SIP：singlein-linepackageSIR：surfaceinsulationresistance絕緣阻抗SMC:SurfaceMountComponent表面黏著元件SMD：SurfaceMountDevice表面黏著元件SMEMA:SurfaceMountEquipmentManufacturersAssociation表面黏著設備製造協會SMT：surfacemounttechnology表面黏著技術SOIC：smalloutlineintegratedcircuitSOJ：smallout-linej—leadedpackageSOP：smallout—linepackage小外型封裝SOT：smalloutlinetransistor電晶體SPC：statisticalprocesscontrol統計過程控制SSOP:shrinksmalloutlinepackage收縮型小外形封裝TAB：tapeautomaticedbonding帶狀自動結合TCE：thermalcoefficientofexpansion膨脹(因熱）係數Tg:glasstransitiontemperature玻璃轉換溫度THD:Throughholedevice須穿過洞之元件（貫穿孔)TQFP：tapequadflatpackage帶狀四方平坦封裝UV：ultraviolet紫外線uBGA：microBGA微小球型矩陣cBGA：ceramicBGA陶瓷球型矩陣PTH：PlatedThruHole導通孔IAInformationAppliance資訊家電產品MESH網目OXIDE氧化物FLUX助焊劑LGA(LandGridArry）封裝技術LGA封裝不需植球，適合輕薄短小產品應用。TCP(TapeCarrierPackage)ACFAnisotropicConductiveFilm異方性導電膠膜製程Soldermask防焊漆SolderingIron烙鐵Solderballs錫球SolderSplash錫渣SolderSkips漏焊Throughhole貫穿孔Touchup補焊Briding穚接（短路)SolderWires