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Micro-LED技术和产业化研究进展
Title:AdvancementsinMicro-LEDTechnologyandIndustrialResearch
Introduction:
Micro-LED(MicroLightEmittingDiode)technologyhasemergedasacutting-edgedisplaytechnologyinrecentyears,displayingsignificantpotentialinvariousapplicationareassuchasTVs,smartphones,wearabledevices,andvirtualreality.Withitssuperiorpropertiessuchashighbrightness,widecolorgamut,highcontrastratio,andlowpowerconsumption,Micro-LEDtechnologyhasgainedattentionasapotentialsuccessortotheexistingdisplaytechnologies.ThispaperaimstoprovideinsightsintotheprogressmadeinMicro-LEDtechnologyanditsindustrialresearchadvancements.
1.OverviewofMicro-LEDTechnology:
Micro-LEDtechnologyisbasedontheconceptofinorganicLEDsthatutilizemicroscopicLEDsaspixels.ThesemicroscopicLEDsaretypicallylessthan100micrometersinsizeandcanbeindividuallycontrolled,resultinginsuperiorcoloraccuracyandimagequality.Thetechnologyconsistsofthreemaincomponents:LEDepitaxialgrowth,transfer,andinterconnectiontechnology.
2.ProgressinLEDEpitaxialGrowth:
TheepitaxialgrowthofMicro-LEDsplaysacrucialroleinachievinghighefficiencyandreliability.SignificantadvancementshavebeenmadeinthegrowthofMicro-LEDmicrostructures,includingimprovedcrystalquality,reduceddislocationdensity,andenhancedlightextractionefficiency.Varioustechniquessuchasmetal-organicchemicalvapordeposition(MOCVD)andmolecularbeamepitaxy(MBE)havebeenemployedtooptimizeepitaxialgrowthprocesses,promotingthedevelopmentofhigh-qualityMicro-LEDs.
3.TransferTechnology:
ThetransfertechnologyinvolvesmovingindividualMicro-LEDsfromthegrowthsubstratetothetargetsubstrate.ThisprocessrequiresprecisionandaccuracytoensurethealignmentandconnectionofeachLED.Severaltransfermethodshavebeendeveloped,suchaslaser-inducedforwardtransfer(LIFT),fluidicassembly,andpick-and-placetechniques.Thesetechniqueshaveshownprogressinachievingautomatedandhigh-throughputtransferprocesses,improvingthescalabilityandyieldofMicro-LEDmanufacturing.
4.InterconnectionTechnology:
Interconnectiontechnologyfocusesonestablishingelec