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突破现有CMOS工艺限制的晶体管技术 Title:EmergingTransistorTechnologies:OvercomingtheLimitationsofCMOSTechnology Introduction: Thecontinuousevolutionofintegratedcircuitsandmicroelectronicshasledtotherapidadvancementofmoderntechnology.Thecornerstoneofthisprogressisthecomplementarymetal-oxide-semiconductor(CMOS)transistortechnology.However,asthesizeoftransistorscontinuestoshrink,severalinherentlimitationsofCMOStechnologyhaveemerged.Thispaperaimstoexploretheevolutionoftransistortechnologiesthatcanpotentiallysurpasstheselimitationsanddrivethenextgenerationofelectronicdevices. I.LimitationsofCMOSTechnology: 1.PowerConsumption:Astransistorsizesreduce,leakagecurrentsincrease,leadingtohigherpowerconsumption. 2.HeatDissipation:Thehighpowerdensityinsmalltransistorshindersefficientheatdissipation,resultinginincreasedoperatingtemperatures. 3.PerformanceBottlenecks:Thereducedsizeoftransistorsleadstoincreasedresistanceandcapacity,limitingtheirswitchingspeedandoverallperformance. 4.QuantumTunneling:Atnanoscaledimensions,quantumtunnelingeffectsbecomesignificant,causingundesiredleakageofchargecurrentandintroducingerrors. II.AlternativeTransistorTechnologies: 1.NanoelectromechanicalSystems(NEMS): a.Overview:NEMSutilizemechanicsatthenanoscaletocontrolelectronflow,offeringhighswitchingspeedsandultra-lowpowerconsumption. b.Advantages:NEMSovercomethelimitationsofCMOSintermsofpowerconsumptionandheatdissipation.Theyalsohavethepotentialforhighintegrationdensity. c.Challenges:FabricationtechniquesandreliabilityissuesneedtobeaddressedbeforeNEMScanbecommerciallyviable. 2.TunnelField-EffectTransistors(TFETs): a.Overview:TFETsusequantumtunnelingphenomenainsteadofthermionicemission,allowinglowersupplyvoltagesandreducedpowerconsumption. b.Advantages:TFETsaddressthepowerconsumptionandheatdissipationissuesofCMOStechnology.Theyalsoexhibitimprovedsub-thresholdslopeandlowleakage. c.Challenges:ControllingtunnelingcharacteristicsanddevelopingscalablefabricationtechniquesareamongthekeychallengesforTFETs. 3.OrganicField-E
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