2019 IECCISPR年会主要技术内容（上）-豆柴文库

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2019IECCISPR年会主要技术内容（上）
Introduction
IECCISPRisaninternationalconferencethatprovidesaplatformforresearchers,engineersandpractitionerstosharetheirexperiencesinthefieldofelectromagneticcompatibilityandelectromagneticinterference.Thisconferencefocusesonthelatestdevelopmentsinthisfieldandprovidesanopportunityforexpertstodiscussthechallengesandsolutionsrelatedtoelectromagneticcompatibility.
The2019IECCISPRconferencewasheldinBeijing,China.Theconferencefeaturedadiverserangeoftechnicalsessionscoveringdifferentaspectsofelectromagneticcompatibilityandelectromagneticinterference.Thispaperaimstodescribethekeytechnicalcontentpresentedattheconference.
KeyTechnicalContentPresentedattheConference
1.ElectromagneticCompatibility(EMC)testing
ThefirsttechnicalsessionoftheconferencefocusedonEMCtesting.Thissessionincludedpresentationsonvarioustestingtechniquesandstandardsusedtomeasuretheelectromagneticcompatibilityofelectronicdevices.Topicsincludedtheuseofantennasformeasuringradiatedemissions,theimportanceofimmunitytestingforelectronicdevices,andthedevelopmentofnewEMCtestingstandards.
Oneofthekeytakeawaysfromthissessionwastheimportanceoftestingduringthedevelopmentphaseofelectronicdevices.Testingenablesengineerstoidentifypotentialelectromagneticinterferenceissuesearlyinthedevelopmentprocess,whichcanleadtosignificantcostsavingsandfastertime-to-market.
2.GroundingandShielding
Thesecondtechnicalsessionfocusedongroundingandshieldingsolutionsforelectronicdevices.Presentationsinthissessioncoveredarangeoftopics,includingthedesignandimplementationofelectromagneticshields,theuseofferritecoresfornoisesuppression,andtheimpactofgroundingonelectromagneticcompatibility.
Oneofthekeytakeawaysfromthissessionwastheneedforgroundingandshieldingsolutionsthataretailoredtospecificapplications.Differentapplicationsrequiredifferentgroundingandshieldingsolutions,andengineersneedtocarefullyconsidertherequirementsofeachapplicationtoensurethatthesolutionsareeffective.
3.ElectromagneticInterference(EMI)inPowerElectron