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PrintedCircuitBoardObjective Introduction Material ManufacturingProcess PCBSuppliercapability TechnologyBenchmark 1)Objective: Provideatrainingmodulethatgivesanoverviewofmaterials,manufacturingprocessesusedtofabricatePCB. 2)ModuleOutline: 2.1WhatisPWB/PCB? 2.2WhatmaterialsareusedtomanufacturePCB? 2.3Whatarethemanufacturingprocessesusedandwhatdotheyaccomplish?2.1)WhatisPWB/PCB? Synonyms Printedcircuit,Circuitboard,Printedcircuitboard,PCB,PrintedcardareallrefertoaPrintedWiringBoard Definition Itisanelectricalcircuitformedbyapplyingconductivematerialinfinelinesorothershapestoaninsulatingsheet,byelectroplating,etc.2.2)WhatmaterialsareusedtomanufacturePCB? Resins: Phenolic,Polyester,Epoxy,Teflon,Cyanacrylates,PPE(PolyphenyleneEther), &others. Therearealsoblends/compoundsoftheseresinsused. Reinforcements: Wovenfiberglasscloth,non-wovenfiberglasscloth,Aramidfiber,etc. Thepredominantstylesofwovenfiberglassare2116and7628whichyielda5miland7.5milthicknessrespectively.CopperFoil: Electroplatedcopperfoilinvariousthicknessareused.Predominately,foils0.7miland1.4milthicknessareused.Theyarealsocalled1/2ozand1ozfoils.Photosensitivefilm/emulsions,developingchemistries Cleaning,copperetching,andoxidizingsolutions Platingchemistries:Copper,Tin,Nickel,Gold,Silver&others. Acrylicandepoxycoatingmaterials (soldermask&legendinks) Solder(Tin/Lead)a)Prepreg Prepregisacompositeofglassfiberclothandepoxyresin. Itisalsocalled“B-stage”sincethethermalsetresinispartiallycured. CommonType Thickness 1080 2.9mil 2116 4.3mil 7628 6.9mil b)Copper-cladlaminate Laminateisalsoacompositeofglassfiberclothandepoxyresin,sameasprepreg.Thedifferenceisepoxyresinoflaminateisfullycured(hardened).itisalsocalled“C-stage”.Differentthicknesscanbemadebyusingdifferentcombinationofprepregs. c)Copper-cladlaminate/Prepreg TheFR-4laminate/prepregaretheonewidelyused.Ithasglassfibersasthebasematerialandepoxyastheresin. Therearealsodifferenttypeofmaterials,likeFR3,FR-5,FR-6,Geteketc. Importantproperties: *StandardFR-4canb
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