半导体英语.docx

一些半导体词汇
admin：半导体,芯片,集成电路,设计,版图,晶圆,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,fabrication,process,layout,package,test,FA,RA,QA,photo,etch,implant,diffustion,lithography,fab,fabless},_7Q6n1G#f:y/|'m2O'h'D&C#t2w5c9q9]半导体,芯片,集成电路,设计,版图,晶圆,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,fabrication,process,layout,package,test,FA,RA,QA,photo,etch,implant,diffustion,lithography,fab,fabless"v8@*v'j4R5m;s半导体,芯片,集成电路,设计,版图,芯片,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,process,layout,package,FA,QA,diffusion,etch,photo,implant,metal,cmp,lithography,fab,fabless半导体词汇半导体,芯片,集成电路,设计,版图,芯片,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,process,layout,package,FA,QA,diffusion,etch,photo,implant,metal,cmp,lithography,fab,fabless6r%s"[-n,{1.acceptancetesting(WAT:waferacceptancetesting)%L,?7y7`;l半导体技术天地2.acceptor:受主，如B，掺入Si中需要接受电子5}4t&y!s:j5x'A3.ACCESS：一个EDA（EngineeringDataAnalysis）系统半导体技术天地-\&r$S%o:['xZ#S"k4.Acid：酸9l9r/L1Z.C*U+K5.Activedevice：有源器件，如MOSFET（非线性，可以对信号放大）(a6s#{(\'R0~1X;Y)\P半导体,芯片,集成电路,设计,版图,芯片,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,process,layout,package,FA,QA,diffusion,etch,photo,implant,metal,cmp,lithography,fab,fabless6.Alignmark(key)：对位标记(Q7~:R;l:Z半导体,芯片,集成电路,设计,版图,芯片,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,process,layout,package,FA,QA,diffusion,etch,photo,implant,metal,cmp,lithography,fab,fabless7.Alloy：合金.J0Q5B/k5E$}+Z6M4w8.Aluminum：铝半导体,芯片,集成电路,设计,版图,芯片,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,process,layout,package,FA,QA,diffusion,etch,photo,implant,metal,cmp,lithography,fab,fabless9@0R+[%f9VIr-O9.Ammonia：氨水半导体技术天地;R9d5b4S*V-c0{/]10.Ammoniumfluoride：NH4F0p4J%Z'u;F)Z5n+H半导体技术天地11.Ammoniumhydroxide：NH4OH半导体,芯片,集成电路,设计,版图,晶圆,制造,工艺,制程,封装,测试,wafer,chip,ic,design,eda,fabrication,process,layout,package,test,FA,RA,QA,photo,etch,implant,diffustion,lithography,fab,fabless0h2A"Y+]#?6d-b+X"G12.Amorphoussilicon：α-Si，非晶硅（不是多晶硅）7t%[4U:J*C2U8z8E"E1E.y)m.Z13.Analog：模拟的f4I#z:q3d#s2M14.Angstrom：A（1E-10m）埃#_1J$r3r0m15.Anisotropic：各向异性（如POLYETCH）1y(w&}6R+j6j7B8V半导体,芯片,集成电路,设计,版图,芯片,制造,工艺,制程,封装,测试,wafer,chi