印制电路词汇.docx

印制电路词汇
1.综合词汇Printedcircuit印制电路Printedwiring印制线路Printedcircuitboard印制电路板Printedwiringboard印制线路板Printedcomponent印制元件Printedcontact印制接点Single-sidedprinted
circuitboard(SSB)单面印制电路板double-sidedprinted
circuitboard(DSB)双面印制电路板Multilayerprinted
circuitboard(MLB)多层印制电路板Rigidprintedcircuitboard刚性印制电路板Flexibleprintedcircuitboard挠性印制电路板Flex-rigidprintedcircuitboard刚挠结合印制电路板Build-upprintedboard积层印制板Surfacelaminarcircuit(SLC)表面层合电路板Build-upmultilayerprinted
Board(BUM)积层多层印制板Metalbaseprintedboard金属基印制板B2itprintedboard埋入凸块互连
印制板ALIVHMultilayer
printedboard层间全内导通
多层印制板Chiponboard(COB)载芯片板Backplane背板Bareboard裸板Break-awaypanel可断拼板Interconnection互连Conductortraceline导线Substrate基底Realestate基板面Conductorside导线面Componentside元件面Solderside焊接面Printing印制grid网格pattern图形Conductivepattern导电图形Non-conductivepattern非导电图形Legend字符Mark标志2．基材
2.1基材的种类和结构Basematerial基材Laminate层压板Copper-cladlaminate(CCL)覆铜箔层压板Prepreg预浸材料Bondingsheet粘结片bondinglayer粘结层Preimpregnatedbondingsheet预浸粘结片Epoxyglasssubstrate环氧玻璃基板Copper-cladsurface铜箔面Foilremovalsurface去铜箔面Lengthwisedirection纵向crosswisedirection横向Corematerial内层芯材UVblockingcopper-cladlaminates紫外光阻挡型覆铜箔板2.2基材的材料A-stageresinA阶树脂B-stageresinB阶树脂C-stageresinC阶树脂epoxyresin环氧树脂Polymer聚合物Photosensitiveresin感光性树脂Thermosettingresin热固性树脂Thermoplasticresin热塑性树脂Adhesive胶粘剂Curingagent固化剂Flameretardant阻燃剂opaquer遮光剂Polyesterfilm(PET)聚酯薄膜Polyimidefilm(PI)聚酰亚胺薄膜Polytetrafluoroethylene(PTFE)聚四氟乙烯Non-wovenfabric非织布/无纺布Glassfiber玻璃纤维Glassfabric玻璃布Warp-wise经向Weft-wise纬向Copperfoil铜箔Electrodepositedcopperfoil电解铜箔Rolledcopperfoil压延铜箔Resincoatedcopperfoil(RCC)涂树脂铜箔ReversedTreatmentFoil翻转处理铜箔DoubleTreatedFoil双面处理铜箔DrumSide/shinyside（铜箔）光面MatteSide（铜箔）毛面2.3基材的制造Polymerize聚合Thermoplastic热塑性Thermoset热固性creep蠕变Gel凝胶体Clad覆箔Layup叠层laminating层压/复合Internalidentificationmark内部识别标志Postcure后固化Geltime凝胶时间Curingtime固化时间Resinflow树脂流动度Resincontent树脂含量3设计
3.1通用术语Computer-aideddesign(CAD)计算机辅助设计Computer-aidedmanufacturing(CAM)计算机辅助制造Routing布线Layout布图设计Componentdensity元件密度Array阵列3.2形状与尺寸Conductor导线Conductorw