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保温装饰一体化板饰面层制备工艺模块化设计
Title:ModularDesignandPreparationofThermalInsulationandDecorativeIntegratedBoardSurfaceLayer
Abstract:
Thethermalinsulationanddecorativeintegratedboard(TIDIB)hasgainedsignificantattentioninrecentyearsduetoitsmultipleadvantages,suchasenergyefficiency,aestheticappeal,andeaseofinstallation.ThispaperaimstoexploreamodulardesignapproachforthepreparationofthesurfacelayerofTIDIB.Themodulardesignensureseasymassproduction,variabilityindesign,andefficientinstallation,whilemaintainingthedesiredthermalinsulationanddecorativeproperties.ThispaperdiscussesthekeyaspectsoftheTIDIBsurfacelayerpreparation,includingmaterialselection,manufacturingprocess,andfutureprospectsofmodulardesignintheconstructionindustry.
1.Introduction:
ThedemandforenergyefficientandvisuallyappealingbuildingmaterialshasledtothedevelopmentofTIDIB.Itcombinesthermalinsulationfunctionswithdecorativefeatures,providingacost-effectiveandsustainablesolutionformodernconstruction.Themodulardesignconceptoffersseveraladvantages,includingflexibilityindesign,fasterconstructiontimeline,andreducedcosts.
2.MaterialSelection:
TheselectionofsuitablematerialsiscrucialforachievingthedesiredthermalinsulationanddecorativepropertiesofTIDIB.Thesurfacelayershouldhavegoodthermalconductivity,weatherresistance,andvisualappeal.Commonlyusedmaterialsincludeexpandedpolystyrene(EPS),extrudedpolystyrene(XPS),polyurethane(PU)foam,androckwool.Thechoiceofmaterialdependsonfactorssuchasclimate,buildingregulations,anddesiredaesthetic.
3.ManufacturingProcess:
ThemodulardesignoftheTIDIBsurfacelayerrequiresanefficientandstandardizedmanufacturingprocess.Thisprocessincludesthefollowingsteps:
3.1.MoldDesign:Modularmoldsaredesignedtoproducestandardizedpanelsizesanddesigns.Themoldscanbeeasilyassembledanddisassembled,allowingforquickproductionandversatilityindesign.
3.2.MaterialPreparation:Theselectedmaterialsarepreparedaccordingtothespecificformulationrequirements.Thismayinvolvemixingorblendingofdifferentmaterialstoachievethedesiredthermal