新型硅麦克风的设计与分析_6

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ABSTRACT

MicroElectroMechanicalSystems(MEMS)areconsistedofmicro-sensor,
micro-actuator,controllingcircuit,interfacecircuitandpowerresource.Theyare
consistedofdifferentkindsofelements,completescertainworks.Theirdevelopment
willengenderprofoundimpactonscienceandtechnology,waysofproduction,quality
oflivingofhumanbeings.Nowadaysalmostofconsumerelectronicsarealongtheway
whichissmaller,moreintellectual,moreintegrative,whichdemandsofmarketthe
MEMSsatisfy,andMEMS’finalinfluenceontheconsumerelectronicsisnotonly
decreasingoftheirsizeandweight,butalsoreducingofcosts,advancingofcapability.
SiliconmicrophonesareoneofthemostimportantmemberofMEMSdevice.
TheygetthemajoradvanceoftheMEMSdevice,thathavetheirsizeofabout
1mm*1mmorless,Whatismore,theyusethesimilartechnologyofintergratedcircuit,
andsomefactoriessuchasInfineoncompanyofGermanyhaveintergratedthesensor
andthecircuitoutsideusingtheintergratedcircuittechnology,finallyminimizethe
wholedevice.
Thispaperanalysis,design,andmanufacturethecapacitanceSiliconMicrophone,
andithashighersensitivityandsimplierstructurethantheotherSiliconmicrophone,so
hereuseit.Thispapergetthroughwiththeworksbelow:
(1)DesignthecompletecapacitanceSiliconMicrophoneanalogymodel,analysis
itwithPSPICE,getresultsthatfrequencyspectrumisflatbelow10kHz,outputvoltage
is5.4244mVat1kHz,resonantfrequencyis44.008kHz;
(2)DesignthecapacitanceSiliconMicrophone,calculateoutitssqueeze-film
-7
numberis0.13,thebiggestamplititudehmax=2.9×10m,therateofchancecapacitance
is33.6%;
(3)WithANSYSsoftwaredemonstrateandsimulatetheworkofcapacitance
SiliconMicrophone,resultoutitsfirstfrequencyis10.509kHz,thebiggestamplititude
is2.242×10-7m,thehigheststressisonthecornerofthecorrugationnearthefixed
point.
(4)ManufacturethecapacitanceSiliconMicrophonewhichhasvibration
membraneradius0.5mm,thenumber,heightandwidthofcorrugationis1,1µmand
5µm,thebackboardareais1.2mm×1.2mm,thicknessis5µmandperforatedgreatly,its
acousticholes’areais100µm×100µm.




Thispaperisofup-to-downdesignspirit,firstlyde